The NanoTorr Series is a high vacuum
magnetron sputtering system that allows multiple materials to be
sputtered on several substrates at one passing. The NanoTorr Series
is a highly customizable, flexible and efficient tool for thin film
coating applications. Standard system is equipped with 8 sputtering
cathodes.
The SpinIE is equipped with a Veeco ion beam source and controller,
and a sophisticated water-cooled substrate holder.
It provides precise surface treatment and etching depth uniformity across the whole substrate.
It is capable of many types of processing from a simple
etch to multiple angle and/or beam energy etches.
The NanoTorr-EVAP is a high vacuum
thermal evaporation system with sputtering. It allows sequential evaporation
and co-evaporation of materials without breaking vacuum. DC/RF/Reactive sputtering of
materials/dielectrics, plasma cleaning, and high temperature substrate heating and rotation
can be done in the same chamber.
The SpinEtcher is a plasma processing system capable of
photoresist ashing using oxygen plasma. The system can accommodate up
to 8-inch substrates. The system is designed to provide a wide range
of plasma operating conditions. It is ideally suited for research,
process development or low volume production.
The SpinTherm can enhance the performance of spintronics devices, magnetic materials and components. It's fully
automated with unlimited user defined recipes. Samples can be thermally
treated in temperatures up to 700 C in a uniform magnetic field up to
0.4 Tesla, all in high vacuum environment or inside a special gas with a selected pressure.
The SpinTron is a circular magnetron sputtering gun that can have a 1, 2, 3, 4 or 6-inch
diameter. It can accommodate a wide range of sputtering targets, metallic or insulating, magnetic or non-magnetic. The internal
magnetic configuration utilizing a circular rare-earth NdFeB permanent magnet enables excellent film uniformity and target
utilization.